Naim Supernait 3
Available in store only
In the six years since the last NAIT integrated amplifiers were released, Naim's research and development team have worked on a range of amplifier improvements. The result is upgraded power amplifier sections for SUPERNAIT 3, delivering greater pace and intimacy to their musical delivery – whether it's driving a pair of loudspeakers or your favourite pair of headphones.
The Naim SUPERNAIT 3 has received significant performance upgrades, including a built-in phono stage, making it a perfect partner for turntables, as well as for streamers, CD players, or any other music source people want to enjoy with the signature Naim sound.
It also includes a Class A preamp output stage which doubles as a headphone amplifier and ceramic heatsink technology that minimises capacitive coupling between the chassis and output transistors for optimum sound quality.
Its inputs are each individually decoupled and hand-wired to minimise noise and interference while internal switching employs ultra-low-noise, constant current sources which are derived directly from the electronic design of their flagship NAC 552 preamplifier.
The SUPERNAIT 3 can be upgraded with Naim's external power supplies, power amplifiers and even cabling upgrades to get the best from all sources.
With their typical obsessive attention to detail – all in service of achieving the most authentic musical performance – the SUPERNAIT 3 benefits from the following features:
Class A headphone amplification
Alps Blue Velvet volume control
Reed relay input selection
Ceramic insulators for the power transistors
Galvanically isolated microprocessor control section
Microphonic-isolating PCB mounts
Step up from the NAIT XS3 to the SUPERNAIT 3 and you benefit from a range of superior features, all designed to deliver even better sound quality:
Full 24V DR module built-in: enjoy the purer power and performance improvement of Naim’s Discrete Regulation technology for the entire pre-amp stage.
Larger toroidal transformer in the power supply: provides greater power and speed of recovery
Additional leaded through-hole components in the signal path: further minimises negative effects of vibration and transient thermal conditions
Chassis-mounted input sockets hand-wired to the circuit boards: offers enhanced vibration isolation